This is a single piece of the 71V632S7PFG device in a TQFP100 package. It is a surfacemount component designed for inclusion in printed circuit boards. The TQFP100 package provides 100 pins in a compact quad flat plastic package, enabling density interconnections in a small footprint. Key benefits pin count in a compact package supports complex circuitry without increasing board size. Standard TQFP100 footprint offers broad PCB compatibility and easier replacement in suitable designs. Suitable for automated SMT assembly and reflow soldering, providing reliable mounting and mechanical stability. Key attributes Model: 71V632S7PFG Package type: TQFP100 (surfacemount) Quantity: 1 piece Package material: plastic encapsulation with metal leads (typical for TQFP) Pin count: 100 Mounting style: surfacemount Footprint compatibility: standard TQFP100 footprints Functionality: as a 71V632S7PFG device, designed for integration in applications requiring a pincount 100pin QFP package Applications and use cases Replacement part for boards utilizing the 71V632S7PFG or similar 100pin TQFP devices, enabling quick and maintenance. designs and prototypes requiring a 100pin surfacemount QFP package to manage multiple signals and interfaces in embedded systems. Embedded systems development, hobbyist and professional projects where a density, 100pin SMT package is advantageous for microcontrollers, DSPs, FPGAs, or other complex ICs. Notes This listing refers to a single piece of the 71V632S7PFG TQFP100 device. Suitable for standard SMT processes and footprint layouts associated with TQFP100 packages.