Operation method    1. Locate, choose and attach the appropriate lens:       The usable of the lenses diameter are 28mm, 38mm, 48mm.       (1)When the area of the chips is below 15mm*15mm, please choose the IR-lamp temperature about 160-240C, and choose the lens which D=28mm to avoid destroying other places, usually it will take you about 20-40seconds.       (2)When the area of the chips is between 15mm*15mm and 30mm*30mm, please choose the IR-lamp temperature about 240-320C, and choose the lens which D=38mm to avoid destroying other places, usually it will take you about 30-60seconds.       (3)When the area of the chips is above 30mm*30mm, please choose the IR-lamp temperature 350C(Attention: you should turn on the pre-heat dish first, and set-up the temperature about 150-200C,wait 3-5minutes to allow the temperature steady on the set-up temperature),and choose the lens which D=48mmto avoid destroying other places, and keep the lamp body direct light. You should control the time carefully to avoid burning the chips       Warning:       The light system will shoot straightly. Please pay more attention to yourself control time to avoid burning out.       2. Open the machine       (1) Check if the connection wire of the lamp body and the 936-Iron is ok.     (2) Locate and attach the power cable to the rear of the re-work station     (3) Confirm all front panel rocker switches are off.     (4) Place the rear AC Power Switch in the ON Position.     (5) Allow the T-862++ Power-On-Self-Test (POST) to complete.     (6) Temperature set-points will display last value used.     (7) Place the target PC Board on the slip-rack and orient to close proximity of estimated position of focused Infrared light,     (8) Adjust the T-862++ Infrared light system height, allow 20-30mm from lens end to PC board target component. (9) Turn on the two switches. They control warm-up plate and light system.       3. PC Board Component Removal and Replacement.       (1)Put the PCB board onto the holder     (2)Turn on the switch of the pre-heat dish, and set-up the temperature     (3)Turn on the switch of the IR-Lamp, Regulate the temperature (the temperature must be warm enough to allow the solder to be liquefied), focus the Infrared light on the chip to be removed.     (4)Once the solder liquefied and melted, use tweezers to remove the chip.       4. Soldering a chip.