This listing is for 1 piece of SY10EP11UKG in an MSOP8 package. Key benefits Compact form factor: 8pin MSOP8 package minimizes board area and supports density layouts. SMT compatibility: designed for standard surface mount assembly with common MSOP8 land patterns and reflow processes. Robust packaging: plastic molded MSOP8 package provides reliable protection for pins in a small, lowprofile package. Clear part traceability: model SY10EP11UKG is clearly identified for design and procurement consistency. Key attributes Functionality: the exact device function and electrical characteristics are defined in the SY10EP11UKG datasheet; refer to it for detailed specifications. Compatibility: MSOP8 footprint and package are compatible with typical SMT workflows and land patterns. Size and packaging: MSOP8 package in a compact, lowprofile format suitable for spacelimited applications. Material: plastic molded MSOP8 package. Performance: performance parameters are specified in the official datasheet for SY10EP11UKG. Use cases Spaceconstrained consumer electronics and wearables where a small, reliable IC is required. Embedded systems and microcontroller peripheral designs that benefit from a compact MSOP8 package. Prototype development and boardlevel evaluation on standard MSOP8 footprints. Product details Count: 1 piece per unit Model: SY10EP11UKG Package: MSOP8 Note: For electrical specs, pinout, thermal characteristics, and detailed performance data, consult the official SY10EP11UKG datasheet.